ENGR 440
MODERN ELECTRONICS MANUFACTURING

Information
4 Credits
Available Fall term
Lecture/Lab
OSU Catalog
 Prerequisites
ST 314
or equivalent		 Contact
Sundar V. Atre
(541) 737-8272
Covell 106

Course Description

Engineering methods applied to electronics manufacturing. Wafer, semiconductor, printed circuit board, surface mount assembly. Quality systems, environmental stewardship, supply chain management, production and economic analysis.

Topics

  • Historical perspective and IC process overview
  • Process steps in IC: Si wafer, film growth, etching, lithography, metallization, packaging
  • MEMS (Guest lecture: Hewlett Packard)
  • Surface Mount Technology: Components, Substrates, Solders, Processes
  • Industrial perspectives on SMT (Guest lecture: Ray Prasad)
  • From Micro to Nano

Learning Outcomes

The student, upon completion of this course, will be able to:

  • Describe and evaluate materials and production characteristics of the major electronics manufacturing processes: Wafer production, IC fabrication, IC packaging, MEMS fabrication, and surface mount technology (SMT).
  • Identify principal components in an electronic product and their features.
  • Describe the key material properties in SMT substrates, SMT components, adhesives, and solders.
  • Identify key processes and applications of MEMS and nanotechnologies.
  • Operate equipment and identify critical process parameters in three principal SMT manufacturing processes: solder paste printing, automated component placement, and infrared reflow soldering./li>