Winter term, even years
ME 311 or 311H;
ENGR 321 or ENGR 321H or MATS 321;
ENGR 322 or MATS 322;
(or instructor permission)
306 Dearborn Hall
Processing of thin films and characterization of the microstructure; diffusion and solid state reactions; mechanical, magnetic and electronic properties of thin films.
- Vacuum science and technology and the kinetic theory of gases
- Adsorption, desorption, and surface diffusion processes
- Nucleation: homogeneous and heterogeneous
- Microstructure development: structure zone model
- Thin film properties and characterization
- Defects in thin films
- Physical vapor deposition and chemical routes to thin films
The student, upon successful completion of this course, will be able to:
- Apply the kinetic theory of gases and basic rules of vacuum science in the design of gas transport and vacuum deposition equipment and processes.
- Describe the fundamental surface processes that occur during thin film deposition and their impact on film morphology.
- Select appropriate conditions for the evaporation of metal films of a desired composition, and predict film uniformity given a specific geometry.
- Determine sputtering yield for a material and explain the differences between various sputtering methods.
- Select the most appropriate film deposition process to achieve a desired outcome, given a specific application.